OPTIhot HB30+ - Hotplate

OPTIhot HB30+

bench mounted Hotplate System for typical lithography baking applications:

• Bench Mounted Hotplate System for wafer up to Ø 12"
  (Ø 300 mm) and substrates up to 9" x 9" (225 mm x 225 mm)

System configuration

• Hotplate System with cover
• Recipe programmable lifting pins (proximity) for 4" - 12" wafer
• Recipe programmable Nitrogen (N2) blow
• 19" controller unit
• Industrial full-colour touchscreen HMI
• Preset and calibrated Temperature Controller
• PC-based recipe management and backup software
• Digital documentation and operating manuals available for download as download

Technical data

• Voltage: UAC= 110 V / N / PE / 60 Hz / 16A or UAC= 230 V / N / PE / 50 Hz / 16A
• Temperature range: Up to 250°C - Adjustable in 1°C steps
• Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
• Lifting pins (Proximity): From Ø 4" up to Ø 12" - Programmable in 0.1 mm steps
• Substrate size: Up to Ø 12" (Ø 300 mm) or 9" x 9" (225 mm x 225 mm)
• Process exhaust: Outer diameter OD 38mm, 30m3/h
• Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
• Vacuum: -0.8 ± 0.2 bar
• Nitrogen (N2): 4.0 ± 0.5 bar
• CE marked system