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OPTIwet ST60 - Spin Wet
Stand-alone spin wet process system for semiconductor substrates
OPTIwetSemi automatic equipment
Prozesse
CleaningEtchingSpinningDevelopingLift-Off
Maximaler Produktdurchmesser
Ø 600 mmOPTIwet ST60
Spin Wet Process System within process:
- Stand - Alone Spin Wet Process System for wafer up to Ø 22” (Ø 560 mm) and substrates up to 16” x 16” (400 mm x 400 mm)
System configuration
- Stand - Alone cabinet with all process modules integrated
- Process chamber made of polypropylene (PP) safety door
- Including one programmable electronic media arm – Programmable in speed and position
- Including Back Side Rinse nozzle for DI-Water
- Emergency Stop Button
- Industrial full-colour touchscreen HMI
- USB interface
- PC-based recipe management and backup software
- Digital documentation and operating manuals available for download
- Requires at least one chuck
Technical data
- Voltage: UAC= 3 x 400 V / N / PE / 50 Hz / 16A
- Motor speed: 1 – 3.000 rpm – Adjustable in 1 rpm steps (pending on substrate size and load)
- Motor acceleration ramp: 1 up to 500 rpm/s – Adjustable in 1 rpm/s steps (pending on substrate size and load)
- Spinning time: 1 up to 999 s – Adjustable in 0.1 s steps
- Substrate size: Up to Ø 22” (Ø 560 mm) or 16” x 16” (400 mm x 400 mm)
- Process chamber: Standard made of Polypropylene (PP)
- Process bowl exhaust: 2 x outer diameter OD 110mm, each 200m3/h
- Chamber exhaust: 2 x outer diameter OD 140mm, each 300m3/h
- Cabinet exhaust: Outer diameter OD 110 mm, 200m3/h
- Controller exhaust: Outer diameter OD 110 mm, 200m3/h
- Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
- Vacuum: -0.8 ± 0.2 bar
- Nitrogen (N2): 4.0 ± 0.5 bar
- Media drain connection to the house drain
- CE marked system