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OPTIhot HB20+ - Hotplate

Aktives Produkt

OPTIhot HB20+ - Hotplate

Hotplate system for lithography baking processes

OPTIhotSemi automatic equipmentManual equipment

Prozesse

Baking

Maximaler Produktdurchmesser

Ø 200 mm
Informationen anfragen

OPTIhot HB20+

bench mounted Hotplate System for typical lithography baking applications:

  • Bench Mounted Hotplate System for wafer up to Ø 8"
    (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150 mm)

System configuration

  • Hotplate System with cover
  • Recipe programmable lifting pins (proximity) for 2" - 8" wafer
  • Recipe programmable Nitrogen (N2) blow
  • 19" controller unit
  • Industrial full-colour touchscreen HMI
  • Preset and calibrated Temperature Controller
  • PC-based recipe management and backup software - For more comfortable
  • recipe writing and storage
  • Digital documentation and operating manuals available for download as download

  • Technical data:
  • Voltage: UAC= 230 V / N / PE / 50 Hz (60 Hz) / 16A
  • Temperature range: Up to 250°C - Adjustable in 0.1°C steps
  • Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
  • Lifting pins (Proximity): From Ø 2" up to Ø 8" - Programmable in 0.1 mm steps
  • Substrate size: Up to Ø 8" (Ø 200 mm) or 6" x 6" (150 mm x 150 mm)
  • Process exhaust: Outer diameter OD 38mm, 30m3/h
  • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
  • Vacuum: -0.8 ± 0.2 bar
  • Nitrogen (N2): 4.0 ± 0.5 bar
  • CE marked system