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OPTIhot HB20+ - Hotplate

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OPTIhot HB20+ - Hotplate

Bench mounted hotplate system including process

OPTIhotSemi automatic equipmentManual equipment

Processes

Baking

Maximum product diameter

Ø 200 mm
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The future technology in the semi conductor industry and production-
bench mounted Hotplate System for typical lithography baking applications:

OPTIhot HB 20+

  • Bench Mounted Hotplate System for wafer up to Ø 8" 
    (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150 mm)

System consists of:

  • Hotplate System with cover
  • Recipe programmable lifting pins (proximity) for 2" - 8" wafer 
  • Recipe programmable Nitrogen (N2) blow
  • 19" controller unit
  • Input display unit with touch
  • Preset and calibrated Temperature Controller
  • Including software for PC / Notebook - For more comfortable
  • recipe writing and storage
  • Including an ENGLISH manual as download
  • Price without installation and training

    Technical data:
  • Voltage: UAC= 230 V / N / PE / 50 Hz (60 Hz) / 16A 
  • Temperature range: Up to 250°C - Adjustable in 0.1°C steps
  • Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
  • Lifting pins (Proximity): From Ø 2" up to Ø 8" - Programmable in 0.1 mm steps
  • Substrate size: Up to Ø 8" (Ø 200 mm) or 6" x 6" (150 mm x 150 mm)
  • Process exhaust: Outer diameter OD 38mm, 30m3/h
  • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
  • Vacuum: -0.8 ± 0.2 bar
  • Nitrogen (N2): 4.0 ± 0.5 bar
  • CE marked system