Product Gallery
Single wafer processing systems
Explore active and discontinued Robotechnik systems for single wafer processing.
Processes
Multiple selection possible
Maximum product diameter
Equipment type
43 products shown
48 products in catalogue
OPTIwet ST75 - Spin Wet
Stand-alone spin wet process system for semiconductor substrates
Max. product diameter: Ø 750 mm
OPTIwet ST60 - Spin Wet
Stand-alone spin wet process system for semiconductor substrates
Max. product diameter: Ø 600 mm
OPTIwet ST30 - Spin Wet
Stand-alone spin wet process system for semiconductor substrates
Max. product diameter: Ø 300 mm
OPTIspray ST30i - Spray Coating
Stand-alone spray coating system for semiconductor processes
Max. product diameter: Ø 300 mm
OPTIspray ST22i - Spray Coating
Stand-alone spray coating system for semiconductor processes
Max. product diameter: Ø 200 mm
OPTIspray ST20i - Spray Coating
Stand-alone spray coating system for semiconductor processes
Max. product diameter: Ø 200 mm
OPTIspin ST32+ - Spin Coating
Spin coating and cleaning system for semiconductor processes
Max. product diameter: Ø 300 mm
OPTIspin ST32 - Spin Coating
Spin coating and cleaning system for semiconductor processes
Max. product diameter: Ø 300 mm
OPTIspin ST30 - Spin Coating
Spin coating and cleaning system for semiconductor processes
Max. product diameter: Ø 300 mm
OPTIspin ST23+ - Spin Coating and Cleaning
Spin coating and cleaning system for semiconductor processes
Max. product diameter: Ø 200 mm
OPTIspin ST23 - Spin Coating and Cleaning
Spin coating and cleaning system for semiconductor processes
Max. product diameter: Ø 200 mm
OPTIspin ST22+ - Spin Coating and Cleaning
Spin coating and cleaning system for semiconductor processes
Max. product diameter: Ø 200 mm
OPTIspin ST22 - Spin Coating and Cleaning
Spin coating and cleaning system for semiconductor processes
Max. product diameter: Ø 200 mm
OPTIspin ST20 - Spin Coating and Cleaning
Spin coating and cleaning system for semiconductor processes
Max. product diameter: Ø 200 mm
OPTIspin SST20 - Spin Coating and Cleaning
Spin coating and cleaning system for semiconductor processes
Max. product diameter: Ø 200 mm
OPTIspin SB30 - Spin Coating
Spin coating and cleaning system for semiconductor processes
Max. product diameter: Ø 300 mm
OPTIspin SB20 - Spin Coating and Cleaning
Spin coating and cleaning system for semiconductor processes
Max. product diameter: Ø 200 mm
OPTIhot VB20 - Hotplate HMDS
HMDS hotplate system for wafer priming and dehydration bake processes
Max. product diameter: Ø 200 mm
OPTIhot SVT20 - Hotplate HMDS
HMDS hotplate system for wafer priming and dehydration bake processes
Max. product diameter: Ø 200 mm
OPTIhot SHT30+ - Hotplate
Hotplate system for lithography baking processes
Max. product diameter: Ø 300 mm
OPTIhot SHT20+ - Hotplate
Hotplate system for lithography baking processes
Max. product diameter: Ø 200 mm
OPTIhot SHT20 - Hotplate
Hotplate system for lithography baking processes
Max. product diameter: Ø 200 mm
OPTIhot HB30+ - Hotplate
Hotplate system for lithography baking processes
Max. product diameter: Ø 300 mm
OPTIhot HB20+ - Hotplate
Hotplate system for lithography baking processes
Max. product diameter: Ø 200 mm
OPTIhot HB20 - Hotplate
Hotplate system for lithography baking processes
Max. product diameter: Ø 200 mm
OPTIcoat ST75 - Spin Coating
Spin coating system with Covered Chuck technology
Max. product diameter: Ø 750 mm
OPTIcoat ST60 - Spin Coating
Spin coating system with Covered Chuck technology
Max. product diameter: Ø 600 mm
OPTIcoat ST32+ - Spin Coating
Spin coating system with Covered Chuck technology
Max. product diameter: Ø 300 mm
OPTIcoat ST32 - Spin Coating
Spin coating system with Covered Chuck technology
Max. product diameter: Ø 300 mm
OPTIcoat ST30 - Spin Coating
Spin coating system with Covered Chuck technology
Max. product diameter: Ø 300 mm
OPTIcoat ST23+ - Spin Coating
Spin coating system with Covered Chuck technology
Max. product diameter: Ø 200 mm
OPTIcoat ST23 - Spin Coating
Spin coating system with Covered Chuck technology
Max. product diameter: Ø 200 mm
OPTIcoat ST22+ - Spin Coating
Spin coating system with Covered Chuck technology
Max. product diameter: Ø 200 mm
OPTIcoat ST22 - Spin Coating
Spin coating system with Covered Chuck technology
Max. product diameter: Ø 200 mm
OPTIcoat ST20 - Spin Coating
Spin coating system with Covered Chuck technology
Max. product diameter: Ø 200 mm
OPTIcoat SST20 - Spin Coating
Spin coating system with Covered Chuck technology
Max. product diameter: Ø 200 mm
OPTIcoat SB30 - Spin Coating
Spin coating system with Covered Chuck technology
Max. product diameter: Ø 300 mm
OPTIcoat SB20 - Spin Coating
Spin coating system with Covered Chuck technology
Max. product diameter: Ø 200 mm
Maximus 806 - Automatic Cluster
Fully automated cluster system for lithography processes
Max. product diameter: Ø 200 mm
Maximus 804 Lift-Off - Automatic Cluster
Fully automated cluster system for lithography processes
Max. product diameter: Ø 200 mm
Maximus 804 - Automatic Cluster
Fully automated cluster system for lithography processes
Max. product diameter: Ø 200 mm
MAXIMUS 6003 - Automatic Cluster
Fully automated cluster system for lithography processes
Max. product diameter: Ø 600 mm
Maximus 1203 - Automatic Cluster
Fully automated cluster system for lithography processes
Max. product diameter: Ø 300 mm