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OPTIspin ST23+ - Spin Coating and Cleaning

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OPTIspin ST23+ - Spin Coating and Cleaning

Spin coating and cleaning system for semiconductor processes

OPTIspinSemi automatic equipment

Processes

CoatingCleaningPrimingBakingSpinningDeveloping

Maximum product diameter

Ø 200 mm
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OPTIspin ST23+

Stand alone spinner module for coating; cleaning, developing, hotplate and HMDS within process

  • Stand - Alone Spinner System for Coating, Cleaning or Developing applications with hotplate and HMDS (HexaMethylDiSilazan -C6H19NSi2) hotplate for wafer up to Ø 8" (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150 mm)

System configuration

  • Spinner system with process bowl cover (hardware interlock secured)
  • Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
  • Hotplate OPTIhot HB 20+ with programmable lifting pins (proximity) for 2" - 8" wafer
  • Programmable Nitrogen (N2) blow
  • Vapor prime HMDS (HexaMethylDiSilazan) hotplate OPTIhot VB 20
  • Industrial full-colour touchscreen HMI for each system
  • USB interface
  • PC-based recipe management and backup software
  • Digital documentation and operating manuals available for download
  • Requires at least one chuck (Not included !)

Technical data

  • Voltage: UAC = 3 x 400 V / N / PE / 50 Hz (60 Hz) / 16A
  • Substrate size: Up to Ø 8" (Ø 200 mm) or 6" x 6" (150 mm x 150 mm)
  • Process exhaust: Outer diameter OD 110 mm, 200m3/h
  • Cabinet exhaust #1: Outer diameter OD 110 mm, 200m3/h
  • Cabinet / HP exhaust #2: Outer diameter OD 110 mm, 200m3/h
  • Process exhaust HMDS: Outer diameter OD 110 mm, 200m3/h
  • Cabinet exhaust HMDS: Outer diameter OD 110 mm, 200m3/h
  • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
  • Vacuum: -0.8 ± 0.2 bar
  • Nitrogen (N2): 4.0 ± 0.5 bar
  • CE marked system

Chucks: Option
Dispense: Option
Nozzle: Option
Hotplate: Option