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Aktives Produkt
OPTIspin ST23+ - Spin Coating and Cleaning
Spin coating and cleaning system for semiconductor processes
OPTIspinSemi automatic equipment
Prozesse
CoatingCleaningPrimingBakingSpinningDeveloping
Maximaler Produktdurchmesser
Ø 200 mmOPTIspin ST23+
Stand alone spinner module for coating; cleaning, developing, hotplate and HMDS within process
- Stand - Alone Spinner System for Coating, Cleaning or Developing applications with hotplate and HMDS (HexaMethylDiSilazan -C6H19NSi2) hotplate for wafer up to Ø 8" (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150 mm)
System configuration
- Spinner system with process bowl cover (hardware interlock secured)
- Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
- Hotplate OPTIhot HB 20+ with programmable lifting pins (proximity) for 2" - 8" wafer
- Programmable Nitrogen (N2) blow
- Vapor prime HMDS (HexaMethylDiSilazan) hotplate OPTIhot VB 20
- Industrial full-colour touchscreen HMI for each system
- USB interface
- PC-based recipe management and backup software
- Digital documentation and operating manuals available for download
- Requires at least one chuck (Not included !)
Technical data
- Voltage: UAC = 3 x 400 V / N / PE / 50 Hz (60 Hz) / 16A
- Substrate size: Up to Ø 8" (Ø 200 mm) or 6" x 6" (150 mm x 150 mm)
- Process exhaust: Outer diameter OD 110 mm, 200m3/h
- Cabinet exhaust #1: Outer diameter OD 110 mm, 200m3/h
- Cabinet / HP exhaust #2: Outer diameter OD 110 mm, 200m3/h
- Process exhaust HMDS: Outer diameter OD 110 mm, 200m3/h
- Cabinet exhaust HMDS: Outer diameter OD 110 mm, 200m3/h
- Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
- Vacuum: -0.8 ± 0.2 bar
- Nitrogen (N2): 4.0 ± 0.5 bar
- CE marked system
Chucks: Option
Dispense: Option
Nozzle: Option
Hotplate: Option