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Maximus 804 Lift-Off - Automatic Cluster

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Maximus 804 Lift-Off - Automatic Cluster

Fully automated cluster system for lithography processes

MaximusFully automatic equipment

Processes

CleaningPrimingBakingSpinningAutomatic ClusterLift-Off

Maximum product diameter

Ø 200 mm
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Maximus 804 Lift-Off

MAXIMUS Series

Automatic Microcluster Systems for Lithography Processes
in the Semiconductor Industry

The fully-automated microcluster systems of the Maximus Series are designed for single-substrate production processes in the semiconductor industry. The system platform handles wafer sizes from Ø 2” up to Ø 750 mm and substrate sizes from 2” x 2” up to 500 mm x 500 mm. According to the process requirements all Maximus systems can be equipped flexibly with different process units like coater, developer, cleaner, hot, cool and primer plates. The Maximus Series provides all features needed for state of the art production tasks like thin-wafer handling, UV curing or Lift-Off.Ø 2” up to Ø 8” | 2” x 2” up to 6” x 6”
Typical chemicals: NMP, DMSO
The Maximus 804 Lift-Off is a dedicated system for high throughput single wafer processes. It is equipped with an immersion soaking bath, a high pressure spray Lift-Off cleaning unit and a final cleaning unit. The highest level of cleanliness is guaranteed through the automatic end-effector change.

System configuration

  • Cabinet MAXIMUS 804 made of stainless steel
  • Glass doors for process area
  • Stainless steel doors for media / maintenance area
  • 3-axis robot, class 1
  • End effectors vacuum standard for Ø 4”, Ø 6” wafer
  • End effectors vacuum standard for Ø 8”wafer
  • Industrial full-colour touchscreen HMI
  • Integrated industrial controller and user interface
  • Cassette loading plates for wafer up to Ø 8“ cassette as I/O
  • Pre-alignment for wafers up to Ø 8“
  • Remote diagnostics and service via secure Ethernet connection
  • PC-based recipe management and backup software
  • CE marked system
  • Digital documentation and operating manuals available for download

Technical data

  • Voltage: UAC= 3 x 208 V / N / PE / 60 Hz / 32A or UAC= 3 x 400 V / N / PE / 50 Hz / 32A
  • Spinner System:
  • Motor speed: 1 up to 10,000 rpm in 1rpm steps (depending on substrate size and load)
  • Motor acceleration ramp: 1 up to 50,000 rpm/sec in steps 1rpm/sec (depending on substrate size and load)
  • Spinning time: 0.1 up to 999sec in 0.1sec steps
  • Standard drain: 5 liter waste tank with high-level sensor inside the cabinet
  • Pressure: Clean Dry Air (CDA) 8 ± 2 bar
  • Vacuum: -0.8 ± 0.2 bar
  • Nitrogen N2 (optional): 4.0 ± 0.5 bar
  • Exhaust connection lift- off bath:1 x OD110mm, up to 200 m3/h
  • Exhaust connection high pressure module: 1 x OD110mm, up to 200 m3/h
  • Exhaust connection cleaner module: 1 x OD110mm, up to 200 m3/h
  • Exhaust connection cabinet: 3 x OD140mm, each up to 300 m3/h