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Maximus 804 Lift-Off - Automatic Cluster
Automatic lift-off cleaning spinner system including process and micro cluster system
MaximusFully automatic equipment
Processes
CoatingCleaningEtchingPrimingBakingSpinningDevelopingAutomatic ClusterSpray Coating
Maximum product diameter
Ø 200 mmMAXIMUS Series
Ø 2” up to Ø 8” | 2” x 2” up to 6” x 6”
Typical chemicals: NMP, DMSO
The Maximus 804 Lift-Off is a dedicated system for high throughput single wafer processes. It is equipped with an immersion soaking bath, a high pressure spray Lift-Off cleaning unit and a final cleaning unit. The highest level of cleanliness is guaranteed through the automatic end-effector change.
Automatic Microcluster Systems for Lithography Processes
in the Semiconductor Industry
Ø 2” up to Ø 8” | 2” x 2” up to 6” x 6”
Typical chemicals: NMP, DMSO
The Maximus 804 Lift-Off is a dedicated system for high throughput single wafer processes. It is equipped with an immersion soaking bath, a high pressure spray Lift-Off cleaning unit and a final cleaning unit. The highest level of cleanliness is guaranteed through the automatic end-effector change.
The System consists of:
- Cabinet MAXIMUS 804 made of stainless steel
- Glass doors for process area
- Stainless steel doors for media / maintenance area
- 3-axis robot, class 1
- End effectors vacuum standard for Ø 4”, Ø 6” wafer
- End effectors vacuum standard for Ø 8”wafer
- Flat touch screen monitor
- Computer as controller and user interface
- Cassette loading plates for wafer up to Ø 8“ cassette as I/O
- Pre-alignment for wafers up to Ø 8“
- Remote control, for quick log file checking for service and maintenance purposes via modem, ISDN interface or USB stick
- Software for easy programming of station recipes and flow recipes at the system or on a connected PC
- CE marked system
- An ENGLISH manual on standard paper and a CD-ROM
Technical Data:
- Voltage: UAC= 3 x 208 V / N / PE / 60 Hz / 32A or UAC= 3 x 400 V / N / PE / 50 Hz / 32A
- Spinner System:
- Motor speed: 1 up to 10,000 rpm in 1rpm steps (depending on substrate size and load)
- Motor acceleration ramp: 1 up to 50,000 rpm/sec in steps 1rpm/sec (depending on substrate size and load)
- Spinning time: 0.1 up to 999sec in 0.1sec steps
- Standard drain: 5 liter waste tank with high-level sensor inside the cabinet
- Pressure: Clean Dry Air (CDA) 8 ± 2 bar
- Vacuum: -0.8 ± 0.2 bar
- Nitrogen N2 (optional): 4.0 ± 0.5 bar
- Exhaust connection lift- off bath:1 x OD110mm, up to 200 m3/h
- Exhaust connection high pressure module: 1 x OD110mm, up to 200 m3/h
- Exhaust connection cleaner module: 1 x OD110mm, up to 200 m3/h
- Exhaust connection cabinet: 3 x OD140mm, each up to 300 m3/h