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OPTIwet ST30 - Spin Wet

Active Product

OPTIwet ST30 - Spin Wet

Stand-alone spin wet process system for semiconductor substrates

OPTIwetSemi automatic equipment

Processes

CleaningEtchingSpinningDevelopingLift-Off

Maximum product diameter

Ø 300 mm
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OPTIwet ST30

Spin Wet Process System within process:

  • Stand - Alone Spin Wet Process System for substrates up to Ø 16” (Ø 400 mm) and up to 12” x 12” (300 mm x 300 mm)

System configuration

  • Stand-Alone cabinet with all process modules integrated
  • Process chamber made of polypropylene (PP) with safety door
  • Including one programmable electronic media arm – Programmable in speed and position
  • Emergency Stop Button
  • Industrial full-colour touchscreen HMI
  • USB interface
  • PC-based recipe management and backup software
  • Including an ENGLISH or GERMAN manual via download
  • Requires at least one chuck

Technical data

  • Voltage: UAC= 3 x 400 V / N / PE / 50 Hz / 16A
  • Speed: 1 – 4.000 rpm – Adjustable in 1 rpm steps (pending on substrate size and load)
  • Acceleration ramp: 1 up to 3.000 rpm/s –
  • Adjustable in 1 rpm/s steps (pending on substrate size and load)
  • Spinning time: 1 up to 999 s – Adjustable in 0.1 s steps
  • Substrate size: Up to Ø 12” (Ø 300 mm) or 9” x 9” (225 mm x 225 mm)
  • Process bowl exhaust:2 x outer diameter OD 110 mm, each 200m3/h
  • Chamber exhaust: 2 x outer diameter OD 140 mm, each 300m3/h
  • Cabinet exhaust: Outer diameter OD 110 mm, 200m3/h
  • Controller exhaust: Outer diameter OD 110 mm, 200m3/h
  • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
  • Vacuum: -0.8 ± 0.2 bar
  • Nitrogen (N2): 4.0 ± 0.5 bar
  • Media drain connection to the house drain
  • CE marked system